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The Lancool III was specially developed for cooling powerful hardware and offers numerous air inlets: The front surrounded by an aluminium frame is characterised by a large-area and fine mesh through which the front fans are supplied with fresh air but repel dust. In the lower part of the frame is an aluminium badge with the manufacturer’s name. The rear the top and the PSU cover are also equipped with generous air inlets and outlets. The Lancool III not only has a lot to offer functionally but is also visually convincing. The tempered glass side panels guarantee an unobstructed view of your installed hardware. Both side panels are hinged at the back of the case and can thus be opened easily. Note: The 3-pin RGB connection cable of the integrated RGB lighting can only be connected to a corresponding 3-pin header 5V of your motherboard in order to synchronise with digitally addressable RGB accessories.
- Mid-tower modular chassis for all kinds of configurations
- Featured airflow optimized mesh structure and hinged side panels
- Supports up to 420 radiator or 3 x 360 radiators and a maximum of 10 fans